Title :

Three-Dimensional Integrated Circuits: Key Technologies and Research Achievements

Speaker :

Dr. Kuan-Neng Chen

Professor

Department of Electronics Engineering,National Chiao Tung University

Venue :

Room 215, William M. W. Mong Engineering Building, CUHK

Date :

Apr 5, 2013, Friday
10:30 AM - 11:30 AM

Abstract :

Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They are attractive options to overcome barriers in device and interconnect scaling; offering opportunity to delay the slow-down of CMOS performance trend. 3D ICs is a relatively new technology and many integration as well as the circuit design choices require optimization. This presentation starts from an overview of 3D ICs and possible applications. This is followed by a description of current research achievements, including the possible process variations and integration schemes, as well as the process technology elements needed to implement 3D ICs. Finally the challenges and current research goals of bringing 3D integration into a production environment are discussed.

Biography :

Prof. Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from the Massachusetts Institute of Technology (MIT). He is currently the Professor of Department of Electronics Engineering in National Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.

Prof. Chen has received NCTU Distinguished Faculty Award, two NCTU Outstanding Industry-Academia Cooperation Achievement Awards, Adventech Young Professor Award, CIEE Outstanding Youth Engineer Award, and EDMA Outstanding Youth Award. He also holds several IBM Awards, including five IBM Invention Plateau Invention Achievement Awards and two Awards from Exploratory Technology Group. Prof. Chen is the editor of the book “3D Integration for VLSI Systems”. He has authored more than 140 publications in book chapters, journals and international conference proceedings, and holds more than 70 patents and patent applications. He has given more than 40 invited talks in industries, research institutes, and universities worldwide. He is currently the committee member of IEEE 3DIC, IEEE SSDM, IMAPS 3D Packaging, and DPS. Prof. Chen is an alternate council member of the Electronics Devices and Materials Association, and a member of Phi Tau Phi Scholastic Honor Society and senior member of the IEEE.

Prof. Chen starts three-dimensional integrated circuits (3D IC) research since 2000. His current research interests are three-dimensional integrated circuits (3D IC), through-silicon via (TSV) technology, wafer bonding technology, phase-change material devices, nano devices.

    **************************************** ALL ARE WELCOME ****************************************

Enquiries: Ms. Winnie Wong / Flora Au-Yeung, Department of Mechanical and Automation Engineering, CUHK at 3943 8337 / 3943 7026. *MAE Series (2012-13) is contained in the World-Wide Web home page at http://www3.mae.cuhk.edu.hk/mae_seminars.php.

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