Title :

Beyond Traditional Joining and Manufacturing Technologies

Speaker :

Dr. Jun WEI

Senior Scientist and Group Manager, Joining Technology Group

Singapore Institute of Manufacturing Technology (SIMTech), Singapore

Venue :

Room 215, William M. W. Mong Engineering Building, CUHK

Date :

Mar 25, 2013, Monday
4:30 PM - 5:30 PM

Abstract :

Followed by a brief introduction of A*STAR and SIMTech, this presentation will summarize the recent research activities on various advanced joining technologies such as metal joining, polymer joining and micro/nanojoining in my group. Then, 3D Additive Manufacturing (AM) technologies will be introduced, which may significantly impact a number of growing industry sectors including Aerospace, Transportation, Oil & Gas, Precision Engineering, MedTech, Electronics and Consumer. Traditional manufacturing has fuelled the industrial revolution that has enabled our world today, yet it contains inherent limitations that point to the need for new approaches. Casting, forming, molding, and machining are complex processes that involve tooling, machinery, computers and robots. The competitive advantages of 3D AM are geometrical freedom, shortened design to product time, reduction in process steps, mass customization and material flexibility. 3D AM simplifies the laborious process of producing complex parts while reducing cost. It is predisposed to industry sectors that require high mix, low volume parts or customized parts.

Biography :

Dr. Jun WEI received the Ph.D. degree from Tsinghua University in Materials Science and Engineering. After worked as a faculty member at Tsinghua University for a few years, he joined Singapore Institute of Manufacturing Technology (SIMTech) in 1997. Currently he is a Group Manager and Senior Scientist of Joining Technology Group in SIMTech, and leading the 3D Additive Manufacturing Programme in Agency of Science, Technology and Research (A*STAR). Dr. Wei’s research is highly interdisciplinary, includes various advanced joining technologies such as metal joining, polymer joining, micro/nanojoining and low temperature bonding; 3D additive manufacturing; low dimensional materials such as metallic, semiconductor and carbon-based nanomaterials.

    **************************************** ALL ARE WELCOME ****************************************

Enquiries: Ms. Winnie Wong / Flora Au-Yeung, Department of Mechanical and Automation Engineering, CUHK at 3943 8337 / 3943 7026. *MAE Series (2012-13) is contained in the World-Wide Web home page at http://www3.mae.cuhk.edu.hk/mae_seminars.php.

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